| 摘要 |
PROBLEM TO BE SOLVED: To provide a sub carrier of an optical semiconductor device whereby a wiring conductor layer is formed from the top to the side of an insulation pedestal with enhanced reliability of electrical connection. SOLUTION: The sub carrier comprises an insulation pedestal 1 having a first step 15a and a second step 15b formed by notching a part between the top and the side of an insulation base 13 shaped almost like rectangular parallelepiped, a PD mounting part 14a which is formed on one side of the insulation pedestal 1 and has an optical semiconductor device (PD) 2 joined thereon, a first wiring pattern 14b which is formed from the top of the insulation pedestal 1 via the first step 15a or the second step 15b to one side of the insulation pedestal 1 and is connected to the PD mounting part 14a, and a second wiring pattern 14c which is electrically connected to the optical semiconductor device 2. COPYRIGHT: (C)2004,JPO
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