| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component device in which an electronic component element and an integrated circuit element are stably joined without sticking a flux to a solder printed on an electronic component element mounting electrode, when the flux is applied to a wiring-board-like integrated circuit element mounting electrode, and to provide a method for manufacturing it. SOLUTION: An electronic component element mounting electrode 5 and an integrated circuit element mounting electrode 4 are formed by making adhere to a surface of a wiring board 10. Further, a solder resist film 7 that is so formed as to expose both the mounting electrodes is formed by making adhere to the surface of the wiring board 10. By joining an electronic component element 2 and an integrated circuit element 1 to the wiring board 10, respectively, the electronic component device is constituted. In the solder resist film 7, a plurality of first openings 8 exposing the electronic component element mounting electrode 5 and a plurality of second openings 9 exposing a plurality of the integrated circuit element mounting electrodes 4 are formed. COPYRIGHT: (C)2004,JPO |
