发明名称 MOLD REPLACEMENT DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a mold replacement device for easily and efficiently replacing a resin sealing mold in a mold device for resin sealing molding. SOLUTION: In order to mount the mold 1 for resin sealing molding detachably to a mold attaching unit 2 of the mold device for resin sealing molding, at first, a base 3 is attached to the mold attaching unit 2 of the mold device, and subsequently, a parallel link mechanism 7 having a mounting unit 4 is attached to the base 3, whereby the mold device is provided with the mold replacement device. Further, the mold 1 disposed on the mold mounting unit 4 of the mold replacement device is installed to the mold attaching unit 2 of the mold device by the parallel link mechanism 7 for the mold replacement device. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003347328(A) 申请公布日期 2003.12.05
申请号 JP20020155132 申请日期 2002.05.29
申请人 TOWA CORP 发明人 IJIRI KAZUHIRO
分类号 B30B15/02;B30B15/34;H01L21/56;(IPC1-7):H01L21/56 主分类号 B30B15/02
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