| 摘要 |
PROBLEM TO BE SOLVED: To surely connect a bump to a connecting object or a metal layer by a wedge effect even when pressure impressed at connecting is comparatively reduced in a fixing method of landless bumps formed by an electrolytic plating method to the connecting object or the metal layer. SOLUTION: The bump whose tip has a conical shape, a pyramid shape, a semi-spherical shape, a wedge shape or the like and whose aspect ratio of 1:1-1:5 and whose height is 3μm or higher is directly formed on wiring by electrolytic anisotropic plating. COPYRIGHT: (C)2004,JPO
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