| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To solve the problems that, with the use of a glass cloth as a stiffener of a substrate, the electrical characteristics are degraded by migration, and manufacturing costs are raised due to the necessity of a process for cutting the glass cloth in forming a cavity. <P>SOLUTION: The composite multilayer substrate 20 is provided with; a core plate 21 consisting of materials having good electrical conductivity, good thermal conductivity and high rigidity; a surface resin layer 22 and a rear resin layer 23, which at least cover the surface and rear of the core plate 21, respectively; and a through hole 24 which passes through the core plate 21. An electronic part 25 is mounted in the through hole 24. The strength of the composite multilayer substrate 20 is ensured by the rigidity of the core plate 21, which as a result eliminates the need of the glass cloth. <P>COPYRIGHT: (C)2004,JPO</p> |
