发明名称 |
CLEAVAGE PLANE FORMING DEVICE, CLEAVAGE PLANE FORMING METHOD, AND METHOD OF MANUFACTURING SEMICONDUCTOR ELEMENT |
摘要 |
PROBLEM TO BE SOLVED: To prevent a thin film from being unexpectedly deposited on a cleavage plane when a cleavage operation is carried out for the formation of a semiconductor element. SOLUTION: Second crystal fixing members 9 and 10 are arranged in a region on a pad 8 so as to pinch a semiconductor crystal 11 between them in a lower region, and the lower region of the semiconductor crystal 11 is fixed between the second crystal fixing members 9 and 10. The bottom of an L-shaped movable unit 13 is arranged on the other region of the pad 8. A movable unit fixing member 18 is arranged on the movable unit 13 so as to fix the movable unit 13 on the pad 8 with a third screw 19. The upper region of the semiconductor crystal 11 is fixed so as to move together with the movable unit 13. The movable unit 13 contains a shape memory alloy, and the shape memory alloy has previously memorized a certain shape and furthermore has previously undergone treatment for removing a mixture contained inside at high temperatures. COPYRIGHT: (C)2004,JPO |
申请公布号 |
JP2003347240(A) |
申请公布日期 |
2003.12.05 |
申请号 |
JP20020152862 |
申请日期 |
2002.05.27 |
申请人 |
FURUKAWA ELECTRIC CO LTD:THE |
发明人 |
HAMAKAWA SATOSHI;OKUBO NORIO |
分类号 |
H01L21/301;H01S5/02;(IPC1-7):H01L21/301 |
主分类号 |
H01L21/301 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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