| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer wiring board which ensures reliability in interlayer connection, while achieving high density in a wiring pattern, and provide a method for its manufacturing. SOLUTION: The multilayer wiring board 101 has an arrangement wherein resin films 23 and wiring patterns 22 are alternately stacked. In order to establish an electrical connection between the wiring patterns 22 which are adjacent to each other in the stacking direction, via holes 24 provided in the resin film 23 are filled with conductive compositions 51. In connecting the conductive compositions 51 through lands 22a in the wiring patterns 22 throughout a plurality of the resin films 23, a limit is set in the number of the conductive compositions 51 to be formed coaxially, and when the number exceeds the limit, the excess conductive compositions 51 are formed at positions deviated from the coaxially positioned conductive compositions 51. COPYRIGHT: (C)2004,JPO |
