| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package in which the transmitting efficiency of a high frequency signal is made excellent, and a semiconductor element housed inside can be normally and stably operated in a long term. SOLUTION: A circuit board 6 placed on the upper main surface of a substrate 1 is configured of a line conductor 6a whose one edge is connected to a central conductor 3b, and whose other edge is electrically connected to a semiconductor element 5 and a coplanar ground conductor 6c formed at the both sides of the line conductor 6a with almost equal intervals on the upper surface of an insulating substrate. The side face of the insulating substrate at one edge side is connected to the internal face of a frame body 2, and a conductive roof-shaped member 12 whose site from the internal face of the frame body 2 to the top end of the connection part of the central conductor 3b and the line conductor 6a is shaped like an almost semi-cylinder coaxially covering the connection part, and whose site at the semiconductor element 5 side from the top end of the connection part is formed as an inclined upward opening shaped like an almost semi-circle is bonded onto the coplanar ground conductor 6c. COPYRIGHT: (C)2004,JPO |
