METHOD OF MANUFACTURING LAMINATED ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To solve the problem that a conductor in a conductor pattern or through hole is disconnected due to the powder of a worked residue, because the powder of the residue adheres to or deposits in the through hole or the periphery of the through hole when the through hole is formed by laser beam machining. SOLUTION: Insulating layers and conductor patterns are laminated upon another and the conductor patterns between the insulating layers are connected to each other through conductors provided in through holes. The through holes are formed in the insulating layers by irradiating the insulating layers with a first laser beam upon. Then the through holes formed in the insulating layers is irradiated with a second laser beam having weaker intensity than the first laser beam has so that the diameter of the beam becomes larger than those of the through holes. COPYRIGHT: (C)2004,JPO