SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR MOUNTING STRUCTURE

摘要

PROBLEM TO BE SOLVED: To prevent a signal delay due to a wiring length and improve a heat radiation efficiency, in a semiconductor device or semiconductor module which is constructed into a three-dimensional structure by folding up a flexible wiring board. SOLUTION: The semiconductor device or semiconductor module comprises the flexible wiring board which has bending sections and has a first principal plane (front principal plane) that can be mounted with a plurality of semiconductor chips at prescribed intervals; and at least one set of laminates composed of stacked semiconductor chips adjacent each other and mounted on the first principal plane (front principal plane) of the flexible wiring board, which is formed as a result of folding up the flexible wiring board at the bending sections, with wirings of the same function of the laminates being electrically connected by short cut wiring boards. COPYRIGHT: (C)2004,JPO