| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which is improved in packaging density at the time of packaging over the conventional structure. <P>SOLUTION: The semiconductor device 50 has such a structure that semiconductor elements 28 and 54 are stacked in one and the same package, and are electrically connected to a land 17 by inner leads 18, 58, and 60. Due to this structure, the package and the land 17 can be jointly used by the semiconductor elements 28 and 54. <P>COPYRIGHT: (C)2004,JPO |
