| 摘要 |
PROBLEM TO BE SOLVED: To widen a range of combinations of mountable chip sizes in a semiconductor device wherein two chips are mounted in a stacked state. SOLUTION: A die pad 2 of a lead frame is held between first and second LSI chips 3 and 6. By making the height of a bonding wire 5, which connects an electrode 4 of the first LSI chip 3 and an inner lead 1, lower than the thickness of the die pad 2, assembly can be made regardless of the size of the second LSI chip 6, leading to the formation of a thin package having a body thickness of 1 mm or less. Due to this structure, restrictions on sizes of the two LSI chips 3 and 6 can be reduced and a range of combinations of sizes of the two LSI chips 3 and 6 can be widened, resulting in realizing a thin device. COPYRIGHT: (C)2004,JPO |
