发明名称 |
HIGH FREQUENCY COMPOSITE COMPONENT |
摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a high frequency composite component used for a high frequency band such as a microwave and formed of a single module comprising a diplexer and a surface acoustic wave (SAW) duplexer in a front end portion for processing a high frequency signal between a transmitting/receiving unit and an antenna of a high frequency circuit of a dual band mobile communication terminal thereby improving characteristics such as reducing insertion loss and satisfying the miniaturization of the mobile communication terminal. <P>SOLUTION: The diplexer 21 is formed of a conductive pattern on pattern dielectric sheets of a laminated structure, the SAW duplexer 22 includes two SAW filters mounted on a cavity of the laminated structure and a phase shifting device formed as a conductive pattern on a dielectric sheet of the laminated structure. <P>COPYRIGHT: (C)2004,JPO</p> |
申请公布号 |
JP2003347963(A) |
申请公布日期 |
2003.12.05 |
申请号 |
JP20030111372 |
申请日期 |
2003.04.16 |
申请人 |
SAMSUNG ELECTRO MECH CO LTD |
发明人 |
LEE CHANG-YONG;SHIN YU SEON;LEE JONG IK |
分类号 |
H03H7/075;H01P1/213;H03H7/46;H04B1/40;H04B1/50;(IPC1-7):H04B1/50 |
主分类号 |
H03H7/075 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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