| 摘要 |
PROBLEM TO BE SOLVED: To attain a semiconductor device manufacturing method for providing a semiconductor device that can select semiconductor devices of other kinds or those manufactured in the other lot even when these semiconductor devices are mixed in semiconductor devices manufactured in a certain manufacturing process. SOLUTION: There is provided the semiconductor device manufacturing method for manufacturing the semiconductor device in which a semiconductor chip cut out of a semiconductor wafer is mounted on a die pad frame of a lead frame 5 to be molded, wherein a recognition mark showing quality or manufacturing information concerning the semiconductor device is formed in the lead frame 5. COPYRIGHT: (C)2004,JPO |
