| 摘要 |
PROBLEM TO BE SOLVED: To provide electronic equipment in which the heat radiation performance of an electronic component element bonded faced down is made satisfactory, and a highly reliable operation is made possible by stabilizing the bonding strength of an electric bonding part. SOLUTION: An electronic component element 2 having a plurality of electrodes 4 electrically connected to a connection pad 3 is mounted on the upper face of a ceramic substrate 1 having a plurality of connection pads 3 so as to be bonded faced down, and resin materials are packed at the lower part of the electronic component element 2 so that electronic equipment can be configured. Then, a thermal via hole 9 filled with satisfactory thermal conductive materials whose contraction rate in sintering is smaller than that of the ceramic substrate 1 is buried inside the ceramic substrate 1 positioned just under the electronic component element 2, and a recessed part 7 is formed on the upper face of the ceramic substrate 1 positioned in the buried region of the thermal via hole 9. COPYRIGHT: (C)2004,JPO |
