发明名称 WIRE MIS-ATTACHING FAILURE DETECTING METHOD AND DETECTING EQUIPMENT OF THE SAME IN WIRE BONDING EQUIPMENT
摘要 <P>PROBLEM TO BE SOLVED: To surely enable wire mis-attaching failure detection irrespective of the magnitude of the capacitance of a semiconductor device. <P>SOLUTION: This detecting equipment is provided with: a pulse generator 10 for forming a sharp rectangular waveform; first and second differentiators 11, 12 for differentiating a rectangular waveform delivered from the pulse generator 10; an adder 13 for adding a first output waveform which is obtained from a clamper 7 through a wire 6 by applying a first differentiated waveform of the first differentiator 11 to a semiconductor device 1, and a second differentiated waveform of the second differentiator 12; a delay device 14 for forming a time delay in such a manner that a second differentiated waveform is input in the adder 13 simultaneously to the first output waveform; and a comparator 15 for deciding whether the wire mis-attaching failure exists by comparing the added waveform with a decision level signal 16 at the time of a decision timing signal. <P>COPYRIGHT: (C)2004,JPO
申请公布号 JP2003347369(A) 申请公布日期 2003.12.05
申请号 JP20020157674 申请日期 2002.05.30
申请人 SHINKAWA LTD 发明人 KYOMASU RYUICHI;AOYANAGI NOBUYUKI;HIRAI NOBUAKI
分类号 H01L21/60 主分类号 H01L21/60
代理机构 代理人
主权项
地址