| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for mounting an electronic part by which the electronic part is mounted while contamination of a circuit element on a substrate is prevented, and bonding characteristics of wire bonding is improved, and to provide a contamination-preventing chip used for the method. <P>SOLUTION: In a step S3 for mounting a contamination-preventing chip, a contamination-preventing chip 7 is mounted on a pad conductor 3 provided to a thick film circuit board 20. In a step S4, solder is reflowed. In a step S5 for collecting the contamination-preventing chip, the contamination-preventing chip 7 is detached from the pad conductor 3 to collect. Because these steps are performed in this order, contamination of the pad conductor 3 due to defluxion of solder flux and scattering of solder powder is prevented. Thereby wire bonding to the pad conductor 3 is performed well. <P>COPYRIGHT: (C)2004,JPO |
