| 摘要 |
PROBLEM TO BE SOLVED: To provide a film carrier constitution including a via and an electric continuity form which can obtain higher reliability and cost reduction as compared with a conventional double-sided wiring film carrier, and to provide its manufacturing method. SOLUTION: In the film carrier, conductor layers exist on both sides of a heat-resistant insulating resin film, and are electrically connected via a via hole penetrating the resin film. In the via hole, a first conductor layer is cut and removed by a punch press, and a second conductor layer is pushed into as far as a nearly a central part of depth of the resin film. COPYRIGHT: (C)2004,JPO
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