| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device by which a junction leak current is suppressed to a minimum by relaxing through dislocation 6 even when the dislocation occurs from the interface of an SiGe layer 2 and a silicon wafer 1. SOLUTION: In the method of manufacturing a semiconductor substrate, the SiGe layer is formed on the substrate with a surface composed of a silicon (a), a semiconductor layer is further formed thereon (b) and heat treatment is performed by applying ion injection into the SiGe layer in a wafer region to be an element isolation forming region (c). COPYRIGHT: (C)2004,JPO
|
