| 摘要 |
PROBLEM TO BE SOLVED: To improve reliability while keeping the high heat dissipation of a semiconductor chip regarding a manufacturing method of a semiconductor device having a structure wherein a lid is arranged on the semiconductor chip, the semiconductor device and a semiconductor device unit. SOLUTION: When a semiconductor device 20A having a semiconductor chip 22 mounted on a substrate 23 and a lid 25 thermally connected to the semiconductor chip 22, a stiffener 28A for restraining the deformation of the semiconductor chip 22 is arranged at the lid arrangement side of the semiconductor ship 22 and then heating is carried out. Thereby, the semiconductor chip 22 wherein the stiffener 28A is arranged is joined to the substrate 23 and the lid 25 is joined to the stiffener 28A after the semiconductor chip 22 wherein the stiffener 28A is arranged is joined to the substrate 23 via a bump 26. COPYRIGHT: (C)2004,JPO
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