发明名称 ELECTRONIC DEVICES AND METHODS OF MANUFACTURE
摘要 <p>An electronic device (110B) comprises a substrate (110B) with a trench (120B) having a lower (121B) portion and a top portion (122B). The lower portion (121B) of the trench (120B) is filled with a cured spin-on compound (130B), while the top portion (122B) is filled with a chemical vapor-deposited compound (140B). Preferably, the chemical vapor-deposited compound (140B) has a surface (141B) that is substantially coplanar with the surface (111B) of the substrate (110B).</p>
申请公布号 WO03021636(B1) 申请公布日期 2003.12.04
申请号 WO2002US26780 申请日期 2002.08.23
申请人 HONEYWELL INTERNATIONAL INC.;ENDISCH, DENIS;LEVERT, JOSEPH 发明人 ENDISCH, DENIS;LEVERT, JOSEPH
分类号 H01L21/76;H01L21/312;H01L21/316;H01L21/762;(IPC1-7):H01L21/76;H01L29/00 主分类号 H01L21/76
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