COPPER LAMINATE, COMPOSITE LAMELLAR MATERIAL COMPRISING SAID COPPER LAMINATE AND A PROCEDURE FOR PRODUCING IT

摘要

The copper laminate is produced by rolling a copper ingot down to a thickness equal or higher than 105 m, and then electroplating the rolled copper sheet with copper. The composite lamellar material, intended in particular for printed circuit boards, comprises the copper laminate and insulating material. The invention also refers to a procedure for making the product, comprising the rolling of a copper ingot down to a thickness equal or higher than 105 m, electroplating the rolled copper sheet with copper, protective treatment, the addition of an insulating material comprising at least a resin-impregnated base material and the application of heat and pressure to the product in order to cure the resin and produce the composite lamellar material. This invention solves the problem of rolled-copper laminate adhesion as well as providing a composite lamellar material comprising said copper sheet for printed circuit boards at low cost.