HEAT SINK FOR SEMICONDUCTOR DIE EMPLOYING PHASE CHANGE COOLING

摘要

An electrical assembly (400), including an electrical device (405); and at least one self-contained phase change package (430) in thermal contact with the electrical device, the self-contained phase change package including an enclosure (435)and a phase change material (440) arranged within the enclosure; wherein the phase change material is suitably selected to change phase during an overload condition.