发明名称 |
SPUTTERING TARGET MATERIAL |
摘要 |
A sputtering target material which comprises an Ag base alloy prepared by adding a specific small amount of In and at least one selected from In, Cu, Ni and Co to Ag, and alloying the resultant mixture. The sputtering target material exhibits a high reflectance and also is excellent in the resistance to sulfuration.
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申请公布号 |
WO03100112(A1) |
申请公布日期 |
2003.12.04 |
申请号 |
WO2003JP06455 |
申请日期 |
2003.05.23 |
申请人 |
ISHIFUKU METAL INDUSTRY CO., LTD.;HASEGAWA, KOICHI;ISHII, NOBUO;ASAKI, TOMOYOSHI |
发明人 |
HASEGAWA, KOICHI;ISHII, NOBUO;ASAKI, TOMOYOSHI |
分类号 |
C23C14/34;(IPC1-7):C23C14/34;C23C14/06;C23C14/14 |
主分类号 |
C23C14/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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