| 摘要 |
The invention is a structural improvement for wafer supporting apparatus, which is applied in a machine capable of providing a support for a wafer during a manufacturing process of semiconductor. The wafer supporting apparatus, disclosed in the invention, includes: a separating seat, a metallic seat, an upper cover, several antennas, and several antenna masks. Wherein, the separating seat may provide a support to the structure of the wafer supporting apparatus, and the upper cover may accommodate the metallic seat therein and is then covered over the separating seat, and the wafer may be put on the upper cover, and the several antennas are placed in the several side recessing holes preset in the side of the separating seat, and the antenna masks cover the antennas for protection and isolate them from outside to avoid the particles to be deposited and attached thereon during the manufacturing process.
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