发明名称 Epoxy resin composition
摘要 An epoxy resin composition comprising a phosphorus-containing epoxy resin and an aromatic polysulfone resin. The epoxy resin composition gives an cured product has not only excellent toughness but also high flame retardancy and high heat resistance, and is advantageous as an insulation material for a multi-layer printed wiring board, particularly, as an insulation material for a build up substrate.
申请公布号 US2003224177(A1) 申请公布日期 2003.12.04
申请号 US20030445946 申请日期 2003.05.28
申请人 SUMITOMO CHEMICAL COMPANY, LIMITED 发明人 FURUTA KATSUHIRO;HAYASHI TOSHIAKI
分类号 C08G59/14;C08G59/30;C08G59/32;C08G59/62;C08L63/00;C08L81/06;C09D163/00;C09D181/06;H05K1/03;H05K3/46;(IPC1-7):B32B27/38 主分类号 C08G59/14
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