| 摘要 |
Flexible interconnect packaging system. The system includes a flexible substrate material that includes internal traces coupled to fingerprint sensor mounted to the substrate. Bonding pads of the fingerprint sensor are connected to conductive trace pads of the internal traces using techniques such as, wire bonding, ball/bump methods, tape automated bonding (TAB), or any other applicable bonding methodology for integrated circuits. The final package includes a pre-molded package the forms an open cavity, thereby allowing a sensor surface of the fingerprint sensor to be exposed for access by a user.
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