发明名称 |
Stacked device assembly |
摘要 |
In order to progress a mounting consistency of electric devices on a substrate, an electronic device assembly, comprising a lower electronic device having electrodes in a surface opposed to the substrate and an upper electronic device having a plurality of the leads each extending from the side surface of own package toward the substrate.
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申请公布号 |
US2003223198(A1) |
申请公布日期 |
2003.12.04 |
申请号 |
US20020308071 |
申请日期 |
2002.12.03 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
KATO NOBUHIRO;KAWAI MASATAKA |
分类号 |
H01L23/36;H01L25/10;H01L25/11;H01L25/18;H05K1/18;(IPC1-7):H05K7/20 |
主分类号 |
H01L23/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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