发明名称 |
Method for manufacturing double-sided circuit board |
摘要 |
A method for manufacturing a double-sided circuit board from a board material having a first electric conductor layer and a first electrically insulating layer, including the steps of: making conduction holes in the board material so as to penetrate only the first electrically insulating layer or both the first electrically insulating layer and the first electric conductor layer; forming an electrically conductive thin-film layer on a surface of the first electrically insulating layer and wall surfaces of the conduction holes; forming a second electrically insulating layer on the electrically conductive thin-film layer; forming a first electric conductor wiring by electroplating on predetermined portions of the electrically conductive thin-film layer; covering the first electric conductor wiring with a chemical-resistant film; forming a second electric conductor wiring by chemically dissolving a predetermined portion of another surface of the first electric conductor layer; and removing the second electrically insulating layer and the film. |
申请公布号 |
US2003221314(A1) |
申请公布日期 |
2003.12.04 |
申请号 |
US20030358219 |
申请日期 |
2003.02.05 |
申请人 |
NITTO DENKO CORPORATION |
发明人 |
NAITO TOSHIKI;SHINOGI YOSHIFUMI;UENDA DAISUKE |
分类号 |
H05K1/02;H05K3/06;H05K3/10;H05K3/18;H05K3/38;H05K3/42;(IPC1-7):H05K3/10 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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