发明名称 |
A SURFACE MOUNT SOLDER METHOD AND APPARATUS FOR DECOUPLING CAPACITANCE AND PROCESS OF MAKING |
摘要 |
A system to package high performance microelectronic devices, such as processors, responds to component transients. In one embodiment, the system includes a decoupling capacitor that is disposed between a Vcc electrical bump and a Vss electrical bump. The decoupling capacitor has Vcc and Vss terminals. The Vcc and Vss terminals share electrical pads with the Vcc electrical bump and the Vss electrical bump. A simple current loop is created that improves the power delivery for the system. |
申请公布号 |
WO03100858(A2) |
申请公布日期 |
2003.12.04 |
申请号 |
WO2003US15972 |
申请日期 |
2003.05.21 |
申请人 |
INTEL CORPORATION |
发明人 |
SEARLS, DAMION;ROTH, WESTON;JACKSON, JAMES |
分类号 |
H01L21/60;H01L23/64;H05K1/02;H05K1/14 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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