| 摘要 |
A semiconductor device is a semiconductor chip having an electric circuit on a surface, a electrode pad formed on the surface of the semiconductor chip, the electrode pad electrically connecting to the electric circuit, a conductive pattern electrically connecting to the pad, a sealing resin covering the electric circuit and the conductive pattern, wherein a part of the conductive pattern is exposed from the sealing resin, a plurality of grooves formed on the part of the conductive pattern, a plurality of the grooves disposed apart from each other and along by a direction of stress expanding the semiconductor chip, and an external electrode electrically connecting to the conductive pattern. This semiconductor device can relive the stress of the external electrodes. As a result, reliance of the semiconductor device can be improved, because the deterioration of the connecting quality can prevent. |
