| 摘要 |
<p>A photosensitive resin composition which comprises (a) a resin having a specific structure, (b) a photosensitive agent and (c) an organic solvent having a boiling point under atmospheric pressure of 100°C to 140 °C, and contains the (c) component in an amount of 50 to 100 wt % relative to the total amount of the organic solvent; and a method for a heat -resistant resin film comprising using the resin composition. The resin composition is advantageous in that it is less prone to causing defects such as transfer marks or furrows.</p> |
