发明名称 Semiconductor device including ferroelectric capacitors and fabricating method thereof
摘要 An embodiment of the present invention is a method of fabricating a semiconductor device. The method comprises forming a film of bottom electrode material entirely over the dielectric film; etching the bottom electrode film to partially define a sidewall of each of bottom electrodes; forming a film of ferroelectric material on the remainder of the bottom electrode film and the exposed surface of the dielectric film; forming a film of top electrode material on the ferroelectric film; and etching the top electrode film, the ferroeleotric film and the remainder of the bottom electrode film until the surface of the dielectric film is exposed to completely define the sidewall of each of the bottom electrodes.
申请公布号 US2003224538(A1) 申请公布日期 2003.12.04
申请号 US20030446829 申请日期 2003.05.29
申请人 NEC ELECTRONICS CORPORATION 发明人 MIYASAKA YOICHI
分类号 H01L21/02;H01L21/314;H01L21/316;H01L21/8246;H01L27/105;H01L27/115;(IPC1-7):H01L21/00 主分类号 H01L21/02
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