| 摘要 |
A semiconductor integrated circuit is provided. A semiconductor package having a printed circuit board, a semiconductor chip mounted on a first surface of said printed circuit board, at least one power supply electrode on a second surface of said printed circuit board and connected to at least one power supply terminal of said semiconductor, and at least one ground electrode on a second surface of said printed circuit board and connected to at least one ground terminal of said semiconductor chip; a decoupling capacitor outside said semiconductor package and formed by a power supply plane connected to said power supply electrodes, and a ground plane connected to said ground electrodes; at least one power supply electrode pad connected to said power supply plane; and at least one ground electrode pad connected to said ground plane.
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