发明名称 METHOD AND DEVICE FOR PLASMA TREATING WORKPIECES
摘要 Disclosed are a method and a device for plasma treating workpieces (5). The workpiece is inserted into a chamber (4) of a treatment station (3), which can be at least partly evacuated, and is positioned within said treatment station by means of a holding element. A connection of the chamber to at least one unit supplying operating means is controlled by a valve block (54) which comprises at least two valves (59, 60, 61) and is disposed near a floor (29) of the chamber.
申请公布号 WO03100124(A1) 申请公布日期 2003.12.04
申请号 WO2003DE01504 申请日期 2003.05.09
申请人 SIG TECHNOLOGY LTD.;LITZENBERG, MICHAEL;LEWIN, FRANK;MUELLER, HARTWIG;VOGEL, KLAUS;ARNOLD, GREGOR;BEHLE, STEPHAN;LUETTRINGHAUS-HENKEL, ANDREAS;BICKER, MATTHIAS;KLEIN, JUERGEN 发明人 LITZENBERG, MICHAEL;LEWIN, FRANK;MUELLER, HARTWIG;VOGEL, KLAUS;ARNOLD, GREGOR;BEHLE, STEPHAN;LUETTRINGHAUS-HENKEL, ANDREAS;BICKER, MATTHIAS;KLEIN, JUERGEN
分类号 H05H1/46;B05D7/24;B08B7/00;B08B9/42;B29C49/42;B65D1/00;B65D23/02;B65G29/00;C03C17/00;C08G83/00;C08J7/00;C08J9/00;C23C14/04;C23C14/50;C23C14/56;C23C16/04;C23C16/40;C23C16/44;C23C16/455;C23C16/458;C23C16/511;C23C16/54;(IPC1-7):C23C16/455;C30B25/14 主分类号 H05H1/46
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