| 摘要 |
A method for forming a fine-pitch flip chip assembly interconnects fine pitch devices after they have been connected to a carrier substrate. A die having a plurality of conductive sections, such as solder balls, is attached to a conductive layer of the substrate. An interconnect pattern is then formed in the conductive layer to connect the conductive sections and generate electronic functionality to the assembly. By forming the interconnect pattern after the device have been connected to the carrier, the invention provides precise alignment between the devices and the interconnect pattern without actually aligning the two components during the assembly process.
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