| 摘要 |
Chamfer processing is carried out by making plate material (W) end faces come in contact with rotating grinding belts (12,13). The grinding surfaces of the opposing side by side grinding belts (12,13) are on the centerline in the thickness direction of the plate material (W). The center point is considered the pivot point as seen from the plate material (W) end faces and in distance is smaller than the thickness of the plate material (W). Pivot motion of the plate material (W) is carried out in the rotating direction of grinding belts (12, 13). This chamfer processing method and device enables chamfer in a small curvature radius without applying a heavy tension load on grinding belts (12,13), and performs uniform deep chamfer processing of multiple plate material (W) simultaneously. <IMAGE> |
