| 摘要 |
<p>The invention relates to a cooling device for at least one semiconductor and/or at least one integrated electronic circuit that is linked with a thermoconducting element. Said cooling device comprises a heat sink that is linked with the thermoconducting element so as to conduct heat. Said thermoconducting element, on the side facing the heat sink, is provided with structures that enlarge its surface. The invention is further characterized in that the heat sink (W), on its side facing the thermoconducting element (7), is provided with counterstructures (10) that enlarge its surface and that engage with the structures (9).</p> |
