| 摘要 |
PROBLEM TO BE SOLVED: To provide a TiCN group cermet having excellent resistance to thermal shock and chipping resistance. SOLUTION: In the TiCN group cermet 1 obtained by connecting a hard dispersion phase 3 with a 5-30 wt.% connection phase 2 consisting essentially of Co and/or Ni, TiN fine particles 7 are dispersed in the hard dispersion phase 3. COPYRIGHT: (C)2004,JPO
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