| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having excellent high resolution, heat resistance, adhesion, electrical properties, thermal shock resistance, PCT resistance and electroless plating resistance required as a solder resist and an interlayer dielectric material of a printed wiring board and as an electroless plating resist. <P>SOLUTION: The photosensitive resin composition comprises an ester compound (A) consisting of a compound having a phenolic hydroxyl group and a carboxylic acid and 0.5 to 10 mass% photoacid generator (B) on the basic of the total mass of the photosensitive resin composition. <P>COPYRIGHT: (C)2004,JPO |
