VACUUM ARC DEPOSITION SYSTEM AND FILM DEPOSITION METHOD USING IT

摘要

PROBLEM TO BE SOLVED: To increase the deposition rate of a film reduced in macroparticles and to maintain stable vacuum arc discharge for a long period of time even in the case of deposition of an insulating film. SOLUTION: A first air-core coil 6 is disposed nearly coaxially with an evaporation surface 5A between an evaporation material 5 and a substrate S. A second air-core coil 7 is disposed around the evaporation material 5 nearly coaxially with the evaporation surface 5A. The lines X2 of magnetic force of the second air-core coil 7 are set in such a way that they extend, at the evaporation surface 5A, in a direction nearly orthogonal to the evaporation surface 5A with the approach to the forward side or in a diameter direction scattering outward with the approach to the forward side. A third coil 8 is disposed behind the evaporation material 5 nearly coaxially with the evaporation surface 5A. COPYRIGHT: (C)2004,JPO