METHOD OF MAKING A FLEXIBLE SUBSTRATE CONTAINING SELF-ASSEMBLING MICROSTRUCTURES

摘要

A substrate has embossed thereon a plurality of shaped recesses of a predetermined precise geometric profile, each recess having a flat bottom surface having a major dimension of about 1000 mum or less, the substrate being capable of undergoing a thermal cycle of about one hour at about 150° C. while maintaining about ±10 mum or less dimensional stability of the embossed shaped indentations, and wherein the substrate comprises an amorphous thermoplastic material. During the thermal cycle the substrate has an elastic modulus greater than about 10¹⁰ dynes/cm² and a viscoelastic index of less than about 0.1.