| 摘要 |
PROBLEM TO BE SOLVED: To provide a test probe for a semiconductor package capable of reducing damaging to a solder ball and solder adhesion and damaging to a contact. SOLUTION: The diameter at a tip part 21 of the contact 20 of the probe 13 is set to be approximately the same as the diameter of the solder ball 2, and a roughly hemispherical recessed part 22 to be brought into contact with the solder ball 2 and a plurality of guide grooves 23 formed from the center of the recessed part toward the radial direction, for guiding the adhering solder from the solder ball 2 to the recessed part 22 are provided on the tip part 21. COPYRIGHT: (C)2004,JPO
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