METHOD FOR FORMING INSULATING LAYER ON PCB

摘要

PURPOSE: A method for forming an insulating layer on a PCB(Printed Circuit Board) is provided to prevent the outflow of the floating insulation material of high temperature and the contamination of the PCB by forming a sealing portion by means of a dam between a pressing portion and a core. CONSTITUTION: A bump(3) having the predetermined height is formed on an upper surface and a bottom surface of a core(2). A plurality of dams(5) having the same height as the bump(3) are formed along edges of the upper surface and the bottom surface of the core(2). An insulating material is coated on an entire surface of the core(2). The predetermined pressure is applied on the entire surface of the core(2) by using a pressing portion(4). The insulating layer having the constant thickness is formed on the entire surface of the core(2) by a sealing portion formed among the pressing portion(4), the dams(5), and the core(2) during the pressing period.