发明名称 RESIN COMPOSITION CONTAINING RED PHOSPHORUS PARTICLE AND PREPREG, LAMINATE AND MULTILAYER PRINTED CIRCUIT BOARD USING THE COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a resin composition that gives a flame-resistant cured article having a low dielectric constant and tangent and a prepreg, a laminate and a multilayer printed circuit board using the composition. SOLUTION: The resin composition contains red phosphorous particles and a crosslinking component having a weight average molecular weight of≤1,000 and a multifunctional stylene group represented by formula (1) (wherein R is a hydrocarbon structure optionally having a substituent; R<SP>2</SP>, R<SP>3</SP>, and R<SP>4</SP>are each independently a hydrogen atom or a 1-6C hydrocarbon group each of which may be different; R<SP>5</SP>, R<SP>6</SP>, R<SP>7</SP>, and R<SP>8</SP>are each a hydrogen atom or a 1-20C hydrocarbon group; n is an integer of≥2). The composition is used for the prepreg, the laminated, and the multilayer printed circuit board. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003342309(A) 申请公布日期 2003.12.03
申请号 JP20020154160 申请日期 2002.05.28
申请人 HITACHI LTD;HITACHI CHEM CO LTD 发明人 AMO SATORU;YAMADA SHINJI;ISHIKAWA TAKAO;TAKAHASHI AKIO;NAKAMURA YOSHIHIRO;HANAWA AKINORI;IIJIMA TOSHIYUKI
分类号 C08J5/24;B32B15/08;C08F2/44;C08F12/34;C08F291/00;C08K3/02;C08K5/3492;C08L101/00;H05K1/03;(IPC1-7):C08F2/44;C08K5/349 主分类号 C08J5/24
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