| 摘要 |
PURPOSE: Anisotropic conductive adhesive for fine pitch having a multilayer structure is provided to obtain stable electrical conductivity by preventing conductive particles contained in the anisotropic conductive adhesive from flowing to the gap between bumps or electrodes, and to increase adhesion between a substrate and an integrated circuit by making a non-conductive adhesion layer filled between bumps or electrodes not include conductive particles. CONSTITUTION: A plurality of electrodes(122) having the first height are disposed at regular intervals. A plurality of bumps(132) having the second height are formed in an integrated circuit(130). The integrated circuit is attached to the substrate to be electrically connected to the electrode by using anisotropic conductive adhesive(140). The first adhesion layer(142) that is non-conductive is 1/2-3/2 times as thick as the second height, including thermosetting resin and a hardening agent for hardening the thermosetting resin. A plurality of conductive particles(143) are of the first distribution density, having an average diameter which is not greater than 1/2 times as large as the width of the gap between the plurality of electrodes or lower. The second adhesion layer(144) that is conductive includes thermosetting resin, a hardening agent for hardening the thermosetting resin and the plurality of conductive particles. The second adhesion layer is formed on a surface of the first adhesion layer, having the second thickness greater than two times as large as the average diameter of the conductive particles. |
