WAFER SENSING SYSTEM AND WAFER TRANSFER MODULE HAVING THE SAME

摘要

PURPOSE: A wafer sensing system and a wafer transfer module having the same are provided to be capable of preventing the damage of a wafer and minimizing process loss by improving a labelling method used as a wafer sensing method. CONSTITUTION: A plurality of labelling portions(22,24,26) is formed at the back side of a wafer(20). At this time, a wafer sensing system includes a sensor installed at a wafer transfer module of a wafer processing apparatus for detecting the labelling portions. Preferably, at least two labelling portions are formed at the back side of the wafer. Preferably, the sensor is installed at an end effector of a robot. At this time, the robot is installed at the inner portion of the wafer transfer module. Preferably, the labelling portion is formed by using a trench type bar code. Preferably, the trench type bar code is capable of being formed by using laser beam.