| 摘要 |
PURPOSE: A handling tweezer is provided to be capable of generating the vacuum pressure demanded for the adsorption of a wafer from the handling tweezer itself for simplifying the composition of an equipment related to the handling tweezer and simultaneously improving the maintenance of the equipment. CONSTITUTION: A handling tweezer is provided with a handle grip part(14a,14b) for elastically controlling the shrinkage and expansion of an opening portion(12a,12b) corresponding to the holding pressure of the handle grip part, an adsorbing part(16) having a fluid path(18) formed at the inner portion, prolonged from the handle grip part and a pair of button valve(20a,20b) installed at the predetermined portion of the handle grip part for controlling the flow of fluid according to the operation of a user.
|
