| 摘要 |
PROBLEM TO BE SOLVED: To obtain a resin paste for semiconductors which has such excellent reliability that a decrease in hot bonding strength does not occur, and the resin paste layer does not peel when subjected to a soldering crack resistance test after moisture absorption. SOLUTION: The resin paste essentially consists of (A) an epoxy resin, (B) a curing agent, (C) a compound having a structure represented by formula (1) in the molecule, and (D) a filler, wherein the component C is present in an amount of 0.1-50 pts.wt. per 100 pts.wt. epoxy resin A. COPYRIGHT: (C)2004,JPO
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