SEMICONDUCTOR DEVICE MOLDING EQUIPMENT FOR AUTOMATICALLY PROCESSING RELEASE AGENT AT MOLD

摘要

PURPOSE: A semiconductor device molding equipment for automatically processing a release agent at a mold is provided to be capable of preventing the deterioration of the release force of the mold due to the repetition of molding processes. CONSTITUTION: A semiconductor device molding equipment is provided with a mold part(400) for being carried out with a molding process, an in-magazine part(100) for storing a lead frame strip, a tablet loading part(200) for storing a tablet, a stack magazine part(850) for stacking molded products, and pick-up part(700) for transferring the molded products to the stack magazine part. At this time, the in-magazine part includes a normal lead frame strip magazine part(110) for stacking a normal lead frame strip, a dummy lead frame strip magazine part(130) for stacking a dummy lead frame strip, and a magazine selecting part(150) for selecting one out of the normal and dummy lead frame strip magazine part corresponding to each work mode.